Pack Of 10 Adhesive Removal For Solder Pads, Used For Phone Motherboard Cpu Chip Adhesive Scraping And Glass Back Cover Scraping

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Pack Of 10 Adhesive Removal For Solder Pads, Used For Phone Motherboard Cpu Chip Adhesive Scraping And Glass Back Cover Scraping

EAN: 17607096473081
Marke: Temu
Kategorie: Maintenance, Upkeep Repairs
  Stainless Steel
Online Shop: TEMU

Aktionspreis: CHF 1.45

statt CHF 14.95 bei TEMU

+ CHF Versandkosten

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