Special 0.02mm Wire For Mobile Phone Repair, Used For Cpu Pad Repair And Jumper Wire For Motherboard Fingerprint Issues.

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Special 0.02mm Wire For Mobile Phone Repair, Used For Cpu Pad Repair And Jumper Wire For Motherboard Fingerprint Issues.

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Special 0.02mm Wire For Mobile Phone Repair, Used For Cpu Pad Repair And Jumper Wire For Motherboard Fingerprint Issues.

EAN:	17599975377081
Marke:	Temu
Kategorie:	Maintenance, Upkeep Repairs
	Metal
Online Shop:	TEMU

Aktionspreis: CHF 4.92

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	Special 0.02mm Wire For Mobile Phone Repair, Used For Cpu Pad Repair And Jumper Wire...	CHF 4.92	Shop besuchen

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