Special 0.02mm Wire For Mobile Phone Repair, Used For Cpu Pad Repair And Jumper Wire For Motherboard Fingerprint Issues.

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Special 0.02mm Wire For Mobile Phone Repair, Used For Cpu Pad Repair And Jumper Wire For Motherboard Fingerprint Issues.

EAN: 17599975377081
Marke: Temu
Kategorie: Maintenance, Upkeep Repairs
  Metal
Online Shop: TEMU

Aktionspreis: CHF 4.57

statt CHF 15.00 bei TEMU

+ CHF Versandkosten

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Special 0.02mm Wire For Mobile Phone Repair, Used For Cpu Pad Repair And Jumper Wire... CHF 4.57 Shop besuchen
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